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The KIT ACTIVE HEATSINK ASTRIAL H15 (1E000502) is an active cooling solution designed for ASTRIAL module installations, combining a 40 × 40 × 10 mm 5 V fan, heatspreader and 2 mm ultrasoft gap pad with the required mounting hardware. It supports reliable thermal management for demanding edge AI, embedded vision and industrial computing applications using the ASTRIAL H15 platform..
The KIT ACTIVE HEATSINK ASTRIAL H15 (1E000502) is an active thermal-management kit from System Electronics, a Coesia brand, intended to provide forced-air cooling for compatible ASTRIAL module installations.
The kit combines a dedicated heatspreader, thermal gap pad and 5 V cooling fan to transfer heat away from the module and improve airflow around the processing hardware. This makes it suitable for edge AI systems that operate under sustained workloads where passive cooling may not provide sufficient thermal margin.
The cooling assembly uses a 40 × 40 × 10 mm 5 V fan mounted above the heatspreader. A 2 mm ultrasoft gap pad sits between the heatspreader and the ASTRIAL module, helping provide thermal contact while accommodating the mechanical interface between components.
System Electronics provides two supported installation methods. Case 1 covers carriers without spacers, where the supplied 1.5 mm spacers are installed between the ASTRIAL module and carrier board. Case 2 is designed for carrier boards that already incorporate the required spacers.
For installation, the manufacturer specifies dedicated screws and washers for fixing the fan to the heatspreader and securing the cooling assembly to the carrier. System Electronics also specifies controlled tightening torque to help prevent damage to the module and surrounding components.
The manufacturer instructs installers to remove the protective liners from the thermal gap pad before use and advises against repeatedly reusing the gap pad after installation.
The kit is particularly relevant to ASTRIAL H15-based edge AI systems. The Astrial H15 is a System-on-Module based on the Hailo-15 vision processor, delivering up to 20 TOPS and supporting applications such as smart cameras, object detection, classification, segmentation and industrial embedded AI.
ASTRIAL H15 integrates 4 GB LPDDR4 memory, 32 GB eMMC, dual 4-lane MIPI CSI, PCIe Gen 3 x4, Gigabit Ethernet and a dual-ISP camera interface, making active thermal management useful in sustained AI vision and industrial workloads.
The active heatsink kit is therefore suitable for developers, system integrators and OEMs designing industrial edge AI, machine vision, smart-camera and embedded computing systems around the Astrial platform.
Manufacturer article code 1E000502
Designed for active cooling of compatible ASTRIAL module installations
Includes a 40 × 40 × 10 mm 5 V cooling fan
Integrated heatspreader
2 mm ultrasoft thermal gap pad
Supports forced-air thermal management
Suitable for sustained edge AI workloads
Two supported mounting configurations
Compatible with carrier boards with or without spacers
Includes required mounting screws and washers
Includes 1.5 mm spacers for applicable installations
Manufacturer-defined tightening torque for safer assembly
Supports industrial embedded computing installations
Suitable for ASTRIAL H15 smart-camera and AI workloads
CE compliant
RoHS compliant
WEEE compliant
The official kit includes:
| Item | Quantity |
|---|---|
| M3 × 16 Allen Bolts | 4 |
| DIN 125 Washers | 4 |
| 40 × 40 × 10 mm 5 V Fan | 1 |
| Heatspreader | 1 |
| 2 mm Ultrasoft Gap Pad | 1 |
| DIN137A M2.6 Wavy Washers | 4 |
| DIN 7985 M2.5 × 10 Screws | 4 |
| 1.5 mm Spacers | 4* |