The KIT ACTIVE HEATSINK ASTRIAL H15 1E000502, officially documented by System Electronics as the ACTIVE HEATSINK ASTRIAL KIT, is designed to provide active thermal management for ASTRIAL module installations operating under sustained processing loads.
The cooling assembly combines a dedicated heatspreader with a 40 × 40 × 10 mm 5 V fan, creating forced airflow across the thermal interface. A 2 mm ultrasoft gap pad sits between the ASTRIAL module and heatspreader to support effective heat transfer while accommodating mechanical tolerances within the assembly.
System Electronics supports two mounting configurations. Case 1 is intended for carrier boards without integrated spacers. In this configuration, the supplied 1.5 mm spacers are positioned between the ASTRIAL module and carrier board to reduce the risk of PCB bending during installation. Case 2 is used when the carrier board already incorporates the required spacers.
For the carrier-without-spacers configuration, System Electronics specifies a tightening torque of 0.3 Nm for both the fan-to-heatspreader assembly and the heatsink kit-to-carrier mounting. For carriers with integrated spacers, the fan-to-heatspreader torque remains 0.3 Nm, while the kit-to-carrier mounting torque is specified at 0.4 Nm.
The manufacturer also specifies that the protective liners must be removed from the thermal gap pad before assembly and advises against repeatedly reusing the gap pad.
The kit is particularly suitable for the ASTRIAL H15, an edge AI System-on-Module based on the Hailo H15 platform. ASTRIAL H15 delivers up to 20 TOPS, includes 4 GB LPDDR4 and 32 GB eMMC, and provides PCIe Gen 3 x4, Gigabit Ethernet, dual MIPI CSI and dual ISP capabilities for embedded vision workloads.
This makes the active heatsink kit suitable for developers and OEMs building smart cameras, machine vision systems, industrial automation platforms, robotics and high-load embedded AI systems where active airflow is preferred over passive cooling.
