Home MYIR | System-On-Modules (SOMs) MYC-J335X-V2
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MYIR | System-On-Modules (SOMs)

MYC-J335X-V2

The MYC-J335X-V2 is a compact, feature-rich System-On-Module (SOM) based on the TI AM335x ARM Cortex-A8 processors, running at up to 1GHz. It integrates 256MB DDR3 SDRAM, 256MB NAND Flash, and offers dual Gigabit Ethernet, USB OTG, and multiple serial ports through its 200-pin DDR2 SO-DIMM expansion interface. Designed for industrial applications, it supports extended temperature operation from -40 to +85°C and runs Linux 4.1.18..

  • Detail
  • Special Features
  • Specification

The MYC-J335X-V2 module is powered by the AM335x processor series, offering a high-performance solution with NEON™ SIMD coprocessor support, making it suitable for multimedia and industrial applications. It comes with a robust range of I/O and connectivity options such as Gigabit Ethernet, USB OTG, serial ports, CAN, and ADC, providing ample flexibility for diverse use cases, including industrial control, embedded gateways, and more. The module is designed for industrial environments, supporting an extended temperature range of -40°C to +85°C. Its comprehensive I/O features make it suitable for a wide range of industrial applications, such as game peripherals, printers, and intelligent charging systems.

  1. Processor: Up to 1GHz TI AM335x ARM Cortex-A8 processors (AM3352, AM3354, AM3356, AM3357, AM3358, AM3359).

  2. Memory:

    • 256MB DDR3 SDRAM (supports up to 512MB)

    • 256MB NAND Flash (supports optional 512MB)

    • 32KB EEPROM

  3. Graphics: SGX530 Graphics Engine for 2D/3D acceleration.

  4. Connectivity: Dual Gigabit Ethernet, 2x USB OTG, 6x Serial ports, 2x CAN, 8x ADC.

  5. Operating System: Ready-to-run Linux 4.1.18 OS.

  6. Temperature Range: Supports -40°C to +85°C extended temperature operation, ideal for industrial-grade applications.

  7. Power Management: Equipped with TI’s TPS65217C Power Management IC.

  • Processor: TI AM3352, AM3354, AM3356, AM3357, AM3358, AM3359 (Up to 1GHz ARM Cortex-A8)

  • Graphics: SGX530 for 2D/3D acceleration

  • Memory:

    • 256MB DDR3 SDRAM (supports up to 512MB)

    • 256MB NAND Flash (supports up to 512MB)

    • 32KB EEPROM

  • I/O Connectivity:

    • 2x Gigabit Ethernet

    • 2x USB OTG

    • Up to 6x Serial ports

    • 2x CAN

    • 8x ADC

    • 2x SPI

    • 2x I2C

    • 3x SDIO (one multiplexed with NAND Flash signals)

  • Power Management: TPS65217C Power Management IC

  • Temperature Range: -40°C to +85°C (industrial grade)

  • Operating System: Linux 4.1.18

  • Expansion Interface: 1.27mm pitch 146-pin DDR2 SO-DIMM gold finger